Prof. Brian Lee
Course Information:
DoArch Envelopes, South Dakota State University, Fall 2021
The work focused on translating detailed envelope assemblies into a digital three-dimensional model, allowing the building to be studied not only as a finished object, but as a system of parts, connections, and material interactions. Particular attention was given to how construction elements are physically assembled and how they respond to forces and conditions from the surrounding environment.
By visualizing these relationships digitally, the project used reconstruction as a method of technical analysis. The goal was to make visible the movement, layering, and behavior of materials and assemblies, providing a clearer understanding of how architectural envelopes mediate between construction, climate, and interior space.